ASSEMBLY PAYMENTS MALAYSIA SDN. BHD.
LEI 549300ZFFY4BYGZ1AX14ACTIVESdn Bhd
Registration identifiers
- LEI
- 549300ZFFY4BYGZ1AX14
- SSM Registration No.
- 202001040513
- Legacy SSM No.
- 1396834-X
- Legal form
- Sdn Bhd(XEOV)
- Registration authority
- SSM (Companies Commission of Malaysia)
- Incorporation date
- 2021-10-29
Look up elsewhere
Addresses
Legal address
LEVEL 13, MENARA 1 SENTRUM 201 / JALAN TUN SAMBANTHAN, BRICKFIELDS, 50470 KUALA LUMPUR, MY-14, MY
Headquarters
LEVEL 13, MENARA 1 SENTRUM 201 / JALAN TUN SAMBANTHAN, BRICKFIELDS, 50470 KUALA LUMPUR, MY
LEI record
- LEI status
- ISSUED
- Next renewal
- 2026-10-27
- Managing LOU
- 213800WAVVOPS85N2205
- Last LEI update
- 2025-09-01
Data sourced from the Global LEI System (GLEIF) under the CC BY 4.0 licence. MSIC Malaysia is not affiliated with the entity above. Information is provided as published by GLEIF; verify with the issuing registrar (SSM or Labuan FSA) before relying on it.