Malaysia Hengyuan International Limited

LEI 254900RMCBR1B91DJ959ACTIVESdn Bhd

Registration identifiers

LEI
254900RMCBR1B91DJ959
SSM Registration No.
LL12508
Legal form
Sdn Bhd(XEOV)
Registration authority
RA000941
Incorporation date
2019-06-28

Addresses

Legal address
Suite 25.3 Level 25 Menara IMC / No. 8, Jalan Sultan Ismail, 50250 Kuala Lumpur, MY-15, MY
Headquarters
Suite 25.3 Level 25 Menara IMC / No. 8, Jalan Sultan Ismail, 50250 Kuala Lumpur, MY

LEI record

LEI status
LAPSED
Next renewal
2020-06-28
Managing LOU
5493001KJTIIGC8Y1R12
Last LEI update
2024-11-26
View on GLEIF

Data sourced from the Global LEI System (GLEIF) under the CC BY 4.0 licence. MSIC Malaysia is not affiliated with the entity above. Information is provided as published by GLEIF; verify with the issuing registrar (SSM or Labuan FSA) before relying on it.